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PCB Manufacturing Capability
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Category
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Item
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Standard
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Advance
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Basic
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Rigid PCB Layer Count
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1-108L
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120L
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Flex & Rigid-Flex PCB Layer Count
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Flex PCB: 1-18L
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Flex PCB: 1-18L
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Rigid-flex PCB: 2-20L
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Rigid-flex PCB+HDI: 2-20L
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Min. Fnished Board Thickness
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0.2 ± 0.05mm(8 ± 2mil)
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0.15 ± 0.025mm(6 ± 1mil)
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Max. Fnished Board Thickness
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6.5 ± 10%mm(256 ± 10%mil)
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10.0 ± 10%mm(394 ± 10%mil)
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Max.Board/Array Size
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1060mm*610mm(41*24inch)
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1100mm*660mm(43*26inch)
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Min. Core Thickness
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0.05mm(2mil)
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0.034mm(1.34mil)
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Stackup
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Through-hole PCB
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YES
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YES
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Mechanical-Blind/buried via PCB
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YES
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YES
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Metal Base PCB
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YES
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YES
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HDI
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1+N+1
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Rigid-flex PCB+HDI
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1+1+N+1+1，2+N+2
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1+1+1+N+1+1+1,3+N+3
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Anylayer
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Base material
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Normal Tg, Middle Tg, High Tg
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Yes
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Yes
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Lead Free,Halogen Free
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Yes
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Yes
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Low Dk Laminate
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Yes
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Yes
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Low Loss Laminate
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Yes
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Yes
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High Frequency Laminate
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Yes
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Yes
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PI Laminate
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Yes
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Yes
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BT Laminate
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Yes
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Yes
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Teflon Laminate
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Yes
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Yes
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Material supplier
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Shengyi, ITEQ, KB, TUC, Grace
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Yes
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Yes
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Isola, Ventec, Nanya, Dopont
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Arlon, Rogers, Wangling, Taconic
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Bergquist, Boyu, Nelco
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Hole
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Min. Mechanical Drill Size
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0.15mm(6mil)
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0.10mm(4mil)
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Min. Laser Drill Size
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0.10mm(4mil)
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0.075mm(3mil)
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Drilling Hole to Hole Accuracy
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± 0.05mm(± 2mil)
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± 0.05mm(± 2mil)
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PTH Tolerance
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± 0.075mm(± 3mil)
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± 0.05mm(± 2mil)
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NPTH Tolerance
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± 0.05mm(± 2mil)
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± 0.038mm(± 1.5mil)
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Controlled Depth Drilling Tolerance
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± 0.10mm(± 4mil)
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± 0.05mm(± 2mil)
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PTH Aspect Ratio
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10:1
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15:1
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Laswer Aspect Ratio
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0.8:1
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1:1
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Min. Distance of hole to trace
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7mil
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6.5mil
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Trace, Soldermask
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Min. Trace Width/Space
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0.075mm/0.075mm(3/3mil)
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0.05mm/0.05mm(2/2mil)
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Trace Width Tolerance
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± 10%
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± 8%
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Min. Base Cu Thickness
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12um(1/3 oz )
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9um(1/4 oz )
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Max. Base Cu Thickness
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12 oz
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12 oz
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Impedance Control Tolerance
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± 10%
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± 5%
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Registration＜10L
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± 0.05mm(± 2mil)
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± 0.038(± 1.5mil)
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Registration≥10L
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± 0.075(± 3mil)
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± 0.05(± 2mil)
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Min. SMT/QFP Pitch
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0.20mm(8mil)
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0.15mm(6mil)
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Min. BGA Pitch
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0.23mm(9mil)
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0.20mm(8mil)
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Min. Solder Bridge Width
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3mil
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3mil
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S/M Registration Tolerance
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± 0.05mm(± 2mil)
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± 0.038mm(± 1.5mil)
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Mechanical
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Routing Tolerance
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± 0.13mm(± 5mil)
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± 0.10mm(± 4mil)
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Punch Tolerance
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± 0.10mm(± 4mil)
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± 0.05mm(± 2mil)
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V-cut Location Tolerance
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± 0.10mm(± 4mil)
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± 0.075mm(± 3mil)
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V-cut Residual Tolerance
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± 0.10mm(± 4mil)
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± 0.05mm(± 2mil)
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Angle & Tolerance of Beveling of G/F
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20°/30°/45°, ± 5°
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20°/30°/45°, ± 5°
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Depth & Tolerance of Beveling of G/F
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1.2 ± 0.20mm(47 ± 8mil)
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1.2 ± 0.10mm(47 ± 4mil)
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Surface Finishing
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Carbon ink
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Nipon
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Peelable Mask
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PETER SD2955
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OSP
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Entek Plus HT; Preflux F2 LX
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ENIG
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Au: 0.03um -0.06um, Ni: 3um -6um
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ENIG+OSP
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Yes
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Immersion Tin
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0.8-1.2um
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Immersion Silver
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Yes
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HASL(Free）
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0.5-40um
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ENEIPG
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Au: 0.015-0.075um; Pd: 0.02-0.075um; Ni: 2-6um
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Electro. Hard Gold
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Au: 0.125-1.270um; Ni: 2.50-6.25um
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Special Process
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Platd edge
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Yes
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Yes
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Half Hole
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Yes
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Yes
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Sidestep hole
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Yes
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Yes
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Via in Pad
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Yes
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Yes
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Back Drill
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Yes
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Yes
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Countersink Hole
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Yes
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Yes
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Advanced
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Buried Capacitor
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Yes
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Yes
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Buried Resistor
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Yes
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Yes
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Embedded coin
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Yes
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Yes
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Rigid-Flex
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Yes
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Yes
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Rigid-Flex + HDI
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Yes
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Yes
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Substrate
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No
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No
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Rigid-Flex + Metal Base
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No
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No
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