| PCB 生产能力表 | |||
| 目录 | 类别 | 量产能力 | 样品能力 |
| 基本生产类型 | Rigid PCB Layer Count | 1-108L | 120L |
| Flex & Rigid-Flex PCB Layer Count | Flex PCB: 1-18L | Flex PCB: 1-18L | |
| Rigid-flex PCB: 2-20L | Rigid-flex PCB+HDI: 2-20L | ||
| Min. Fnished Board Thickness | 0.2 ± 0.05mm(8 ± 2mil) | 0.15 ± 0.025mm(6 ± 1mil) | |
| Max. Fnished Board Thickness | 6.5 ± 10%mm(256 ± 10%mil) | 10.0 ± 10%mm(394 ± 10%mil) | |
| Max.Board/Array Size | 1060mm*610mm(41*24inch) | 1100mm*660mm(43*26inch) | |
| Min. Core Thickness | 0.05mm(2mil) | 0.034mm(1.34mil) | |
| 压合结构 | Through-hole PCB | YES | YES |
| Mechanical-Blind/buried via PCB | YES | YES | |
| Metal Base PCB | YES | YES | |
| HDI | 1+N+1 | Rigid-flex PCB+HDI | |
| 1+1+N+1+1，2+N+2 | |||
| 1+1+1+N+1+1+1,3+N+3 | |||
| Anylayer | |||
| 基本板材 | Normal Tg, Middle Tg, High Tg | Yes | Yes |
| Lead Free,Halogen Free | Yes | Yes | |
| Low Dk Laminate | Yes | Yes | |
| Low Loss Laminate | Yes | Yes | |
| High Frequency Laminate | Yes | Yes | |
| PI Laminate | Yes | Yes | |
| BT Laminate | Yes | Yes | |
| Teflon Laminate | Yes | Yes | |
| 板材供应商 | Shengyi, ITEQ, KB, TUC, Grace | Yes | Yes |
| Isola, Ventec, Nanya, Dopont | |||
| Arlon, Rogers, Wangling, Taconic | |||
| Bergquist, Boyu, Nelco | |||
| 钻孔能力 | Min. Mechanical Drill Size | 0.15mm(6mil) | 0.10mm(4mil) |
| Min. Laser Drill Size | 0.10mm(4mil) | 0.075mm(3mil) | |
| Drilling Hole to Hole Accuracy | ± 0.05mm(± 2mil) | ± 0.05mm(± 2mil) | |
| PTH Tolerance | ± 0.075mm(± 3mil) | ± 0.05mm(± 2mil) | |
| NPTH Tolerance | ± 0.05mm(± 2mil) | ± 0.038mm(± 1.5mil) | |
| Controlled Depth Drilling Tolerance | ± 0.10mm(± 4mil) | ± 0.05mm(± 2mil) | |
| PTH Aspect Ratio | 10:1 | 15:1 | |
| Laswer Aspect Ratio | 0.8:1 | 1:1 | |
| Min. Distance of hole to trace | 7mil | 6.5mil | |
|
线路蚀刻 和阻焊能力 |
Min. Trace Width/Space | 0.075mm/0.075mm(3/3mil) | 0.05mm/0.05mm(2/2mil) |
| Trace Width Tolerance | ± 10% | ± 8% | |
| Min. Base Cu Thickness | 12um(1/3 oz ) | 9um(1/4 oz ) | |
| Max. Base Cu Thickness | 12 oz | 12 oz | |
| Impedance Control Tolerance | ± 10% | ± 5% | |
| Registration＜10L | ± 0.05mm(± 2mil) | ± 0.038(± 1.5mil) | |
| Registration≥10L | ± 0.075(± 3mil) | ± 0.05(± 2mil) | |
| Min. SMT/QFP Pitch | 0.20mm(8mil) | 0.15mm(6mil) | |
| Min. BGA Pitch | 0.23mm(9mil) | 0.20mm(8mil) | |
| Min. Solder Bridge Width | 3mil | 3mil | |
| S/M Registration Tolerance | ± 0.05mm(± 2mil) | ± 0.038mm(± 1.5mil) | |
| 外形加工能力 | Routing Tolerance | ± 0.13mm(± 5mil) | ± 0.10mm(± 4mil) |
| Punch Tolerance | ± 0.10mm(± 4mil) | ± 0.05mm(± 2mil) | |
| V-cut Location Tolerance | ± 0.10mm(± 4mil) | ± 0.075mm(± 3mil) | |
| V-cut Residual Tolerance | ± 0.10mm(± 4mil) | ± 0.05mm(± 2mil) | |
| Angle & Tolerance of Beveling of G/F | 20°/30°/45°, ± 5° | 20°/30°/45°, ± 5° | |
| Depth & Tolerance of Beveling of G/F | 1.2 ± 0.20mm(47 ± 8mil) | 1.2 ± 0.10mm(47 ± 4mil) | |
|
表面处理 |
Carbon ink | Nipon | |
| Peelable Mask | PETER SD2955 | ||
| OSP | Entek Plus HT; Preflux F2 LX | ||
| ENIG | Au: 0.03um -0.06um, Ni: 3um -6um | ||
| ENIG+OSP | Yes | ||
| Immersion Tin | 0.8-1.2um | ||
| Immersion Silver | Yes | ||
| HASL(Free） | 0.5-40um | ||
| ENEIPG | Au: 0.015-0.075um; Pd: 0.02-0.075um; Ni: 2-6um | ||
| Electro. Hard Gold | Au: 0.125-1.270um; Ni: 2.50-6.25um | ||
| 其他制程 | Platd edge | Yes | Yes |
| Half Hole | Yes | Yes | |
| Sidestep hole | Yes | Yes | |
| Via in Pad | Yes | Yes | |
| Back Drill | Yes | Yes | |
| Countersink Hole | Yes | Yes | |
|
高难度 制程 |
Buried Capacitor | Yes | Yes |
| Buried Resistor | Yes | Yes | |
| Embedded coin | Yes | Yes | |
| Rigid-Flex | Yes | Yes | |
| Rigid-Flex + HDI | Yes | Yes | |
| Substrate | No | No | |
| Rigid-Flex + Metal Base | No | No | |
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