8L

Parameter
Layers: 8L
material: FR-4+PI
Board Thicknes: 1.8 mm
Copper Thicknes: 35 um
Line/Space: 4/4 mil
Smallest Hole Diameter: 0.25mm
Surface Treatment: ENIG(1U")

Technical Feature:
Rigid-Flex, 4L Flexible board

Applications
Computer, Communication, Medical, Auotomobile, Aerospace, Military