Capability
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PCB Manufacturing Capability |
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Category |
Item |
Standard |
Advance |
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Basic |
Rigid PCB Layer Count |
1-108L |
120L |
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Flex & Rigid-Flex PCB Layer Count |
Flex PCB: 1-18L |
Flex PCB: 1-18L |
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Rigid-flex PCB: 2-20L |
Rigid-flex PCB+HDI: 2-20L |
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Min. Fnished Board Thickness |
0.2 ± 0.05mm(8 ± 2mil) |
0.15 ± 0.025mm(6 ± 1mil) |
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Max. Fnished Board Thickness |
6.5 ± 10%mm(256 ± 10%mil) |
10.0 ± 10%mm(394 ± 10%mil) |
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Max.Board/Array Size |
1060mm*610mm(41*24inch) |
1100mm*660mm(43*26inch) |
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Min. Core Thickness |
0.05mm(2mil) |
0.034mm(1.34mil) |
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Stackup |
Through-hole PCB |
YES |
YES |
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Mechanical-Blind/buried via PCB |
YES |
YES |
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Metal Base PCB |
YES |
YES |
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HDI |
1+N+1 |
Rigid-flex PCB+HDI |
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1+1+N+1+1，2+N+2 |
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1+1+1+N+1+1+1,3+N+3 |
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Anylayer |
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Base material |
Normal Tg, Middle Tg, High Tg |
Yes |
Yes |
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Lead Free,Halogen Free |
Yes |
Yes |
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Low Dk Laminate |
Yes |
Yes |
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Low Loss Laminate |
Yes |
Yes |
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High Frequency Laminate |
Yes |
Yes |
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PI Laminate |
Yes |
Yes |
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BT Laminate |
Yes |
Yes |
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Teflon Laminate |
Yes |
Yes |
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Material supplier |
Shengyi, ITEQ, KB, TUC, Grace |
Yes |
Yes |
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Isola, Ventec, Nanya, Dopont |
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Arlon, Rogers, Wangling, Taconic |
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Bergquist, Boyu, Nelco |
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Hole |
Min. Mechanical Drill Size |
0.15mm(6mil) |
0.10mm(4mil) |
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Min. Laser Drill Size |
0.10mm(4mil) |
0.075mm(3mil) |
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Drilling Hole to Hole Accuracy |
± 0.05mm(± 2mil) |
± 0.05mm(± 2mil) |
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PTH Tolerance |
± 0.075mm(± 3mil) |
± 0.05mm(± 2mil) |
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NPTH Tolerance |
± 0.05mm(± 2mil) |
± 0.038mm(± 1.5mil) |
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Controlled Depth Drilling Tolerance |
± 0.10mm(± 4mil) |
± 0.05mm(± 2mil) |
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PTH Aspect Ratio |
10:01 |
15:01 |
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Laswer Aspect Ratio |
0.8:1 |
01:01 |
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Min. Distance of hole to trace |
7mil |
6.5mil |
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Trace, Soldermask |
Min. Trace Width/Space |
0.075mm/0.075mm(3/3mil) |
0.05mm/0.05mm(2/2mil) |
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Trace Width Tolerance |
± 10% |
± 8% |
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Min. Base Cu Thickness |
12um(1/3 oz ) |
9um(1/4 oz ) |
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Max. Base Cu Thickness |
12 oz |
30oz |
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Impedance Control Tolerance |
± 10% |
± 5% |
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Registration＜10L |
± 0.05mm(± 2mil) |
± 0.038(± 1.5mil) |
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Registration≥10L |
± 0.075(± 3mil) |
± 0.05(± 2mil) |
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Min. SMT/QFP Pitch |
0.20mm(8mil) |
0.15mm(6mil) |
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Min. BGA Pitch |
0.23mm(9mil) |
0.20mm(8mil) |
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Min. Solder Bridge Width |
3mil |
3mil |
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S/M Registration Tolerance |
± 0.05mm(± 2mil) |
± 0.038mm(± 1.5mil) |
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Mechanical |
Routing Tolerance |
± 0.13mm(± 5mil) |
± 0.10mm(± 4mil) |
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Punch Tolerance |
± 0.10mm(± 4mil) |
± 0.05mm(± 2mil) |
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V-cut Location Tolerance |
± 0.10mm(± 4mil) |
± 0.075mm(± 3mil) |
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V-cut Residual Tolerance |
± 0.10mm(± 4mil) |
± 0.05mm(± 2mil) |
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Angle & Tolerance of Beveling of G/F |
20°/30°/45°, ± 5° |
20°/30°/45°, ± 5° |
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Depth & Tolerance of Beveling of G/F |
1.2 ± 0.20mm(47 ± 8mil) |
1.2 ± 0.10mm(47 ± 4mil) |
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Surface Finishing |
Carbon ink |
Nipon |
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Peelable Mask |
PETER SD2955 |
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OSP |
Entek Plus HT; Preflux F2 LX |
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ENIG |
Au: 0.03um -0.06um, Ni: 3um -6um |
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ENIG+OSP |
Yes |
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Immersion Tin |
0.8-1.2um |
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Immersion Silver |
Yes |
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HASL(Free） |
0.5-40um |
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ENEIPG |
Au: 0.015-0.075um; Pd: 0.02-0.075um; Ni: 2-6um |
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Electro. Hard Gold |
Au: 0.125-1.270um; Ni: 2.50-6.25um |
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Special Process |
Platd edge |
Yes |
Yes |
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Half Hole |
Yes |
Yes |
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Sidestep hole |
Yes |
Yes |
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Via in Pad |
Yes |
Yes |
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Back Drill |
Yes |
Yes |
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Countersink Hole |
Yes |
Yes |
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Advanced |
Buried Capacitor |
Yes |
Yes |
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Buried Resistor |
Yes |
Yes |
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Embedded coin |
Yes |
Yes |
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Rigid-Flex |
Yes |
Yes |
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Rigid-Flex + HDI |
Yes |
Yes |
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Substrate |
No |
No |
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Rigid-Flex + Metal Base |
No |
No |
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【软硬结合板制程能力】 |
Rigid-Flex PCB Manufacturing Capability |
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项目类别 |
中小批量（交货面积≥10㎡） |
样板能力（交货面积＜3㎡） |
Item Category |
Small to Medium Batch (Delivery Area ≥10㎡) |
Prototype Capability (Delivery Area <3㎡) |
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产品结构 |
1+n+1；1+1+n+1+1；2+n+2 |
1+n+1、1+1+n+1+1、2+n+2 |
Product Structure |
1+n+1; 1+1+n+1+1; 2+n+2 |
1+n+1; 1+1+n+1+1; 2+n+2 |
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F+R、cu+F+cu、R+F+R+F+R、R+F+R |
F+R、cu+F+cu、R+F+R+F+R、R+F+R |
F+R, cu+F+cu, R+F+R+F+R, R+F+R |
F+R, cu+F+cu, R+F+R+F+R, R+F+R |
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层数 |
软硬结合总层数 |
≤18L |
≤24L |
Number of Layers |
Total Rigid-Flex Layers |
≤18L |
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软板层数 |
≤10L |
≤16L |
Flex Layers |
≤10L |
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板厚 (mm) |
软硬结合板 |
0.3-3.2 |
0.3-3.2 |
Board Thickness (mm) |
Rigid-Flex PCB |
0.3-3.2 |
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软板 |
0.06-0.35 |
0.06-0.35 |
Flex PCB |
0.06-0.35 |
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单板尺寸 (mm) |
软硬结合尺寸 |
15*15-310*510 |
15*15-310*510 |
Single Board Size (mm) |
Rigid-Flex PCB Size |
15*15-310*510 |
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软板尺寸 |
5*15-310*510 |
5*15-310*510 |
Flex PCB Size |
15*15-310*510 |
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铜厚 (OZ) |
硬板层最大铜厚 |
外层2OZ，内层2OZ |
外层2OZ，内层2OZ |
Copper Thickness (OZ) |
Max Copper Thickness for Rigid Layers |
Outer Layer 2OZ, Inner Layer 2OZ |
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软板及相邻硬板层最大铜厚 |
外层1 OZ,内层 1 OZ |
外层2 OZ,内层 2 OZ |
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Max Copper Thickness for Flex and Adjacent Rigid Layers |
Outer Layer 1 OZ, Inner Layer 1 OZ |
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最小线宽线距能力 (um) |
75/75 |
75/75 |
Minimum Line Width/Spacing Capability (um) |
75/75 |
75/75 |
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机械钻刀最小直径 (mm) |
0.2 |
0.15 |
Minimum Mechanical Drill Diameter (mm) |
0.2 |
0.15 |
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硬板材料 |
Tg170 |
S1000-2M,IT180A |
S1000-2M,IT180A |
Rigid Material |
Tg170 |
S1000-2M, IT180A |
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高TG无卤 |
S1165 |
S1165 |
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High TG Halogen-Free |
S1165 |
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介质层厚度 (mm) |
0.1-3.2 |
0.075-3.2 |
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Dielectric Layer Thickness (mm) |
0.1-3.2 |
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软板材料 |
挠性材料 |
PI 杜邦、松下、生益 |
PI 杜邦、松下、生益 |
Flex Material |
Flexible Materials |
PI DuPont, Panasonic, Shengyi |
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表面绝缘层 |
覆盖膜、油墨 |
覆盖膜、油墨 |
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Surface Insulation Layer |
Coverlay, Ink |
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介质层厚度 (mm) |
0.025-0.1 |
0.012-0.1 |
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Dielectric Layer Thickness (mm) |
0.025-0.1 |
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增加层 (mm) |
FR-4增强层 |
0.1-3.2 |
0.1-3.2 |
Reinforcement Layer Thickness (mm) |
FR-4 Reinforcement Layer |
0.1-3.2 |
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PI增强板 |
0.075-0.225 |
0.075-0.225 |
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PI Reinforcement Layer |
0.075-0.225 |
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表面处理 |
软硬结合板 |
有/无铅喷锡、沉金、沉锡、沉银、OSP、喷锡+金手指、沉金+金手指、镍钯金、OSP+金手指、沉金+OSP |
有/无铅喷锡、沉金、沉锡、沉银、OSP、喷锡+金手指、沉金+金手指、镍钯金、OSP+金手指、沉金+OSP |
Surface Treatment |
Rigid-Flex PCB |
Lead/Lead-free HASL, ENIG, Immersion Tin, Immersion Silver, OSP, HASL+Gold Finger, ENIG+Gold Finger, ENEPIG, OSP+Gold Finger, ENIG+OSP |
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软板 |
沉金 |
有/无铅喷锡、沉金、OSP |
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Flex PCB |
ENIG |
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